JPH073575Y2 - 中継端子 - Google Patents
中継端子Info
- Publication number
- JPH073575Y2 JPH073575Y2 JP1416490U JP1416490U JPH073575Y2 JP H073575 Y2 JPH073575 Y2 JP H073575Y2 JP 1416490 U JP1416490 U JP 1416490U JP 1416490 U JP1416490 U JP 1416490U JP H073575 Y2 JPH073575 Y2 JP H073575Y2
- Authority
- JP
- Japan
- Prior art keywords
- connecting portion
- wire
- thin
- relay terminal
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1416490U JPH073575Y2 (ja) | 1990-02-14 | 1990-02-14 | 中継端子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1416490U JPH073575Y2 (ja) | 1990-02-14 | 1990-02-14 | 中継端子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03104963U JPH03104963U (en]) | 1991-10-30 |
JPH073575Y2 true JPH073575Y2 (ja) | 1995-01-30 |
Family
ID=31517541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1416490U Expired - Lifetime JPH073575Y2 (ja) | 1990-02-14 | 1990-02-14 | 中継端子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH073575Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005347459A (ja) * | 2004-06-02 | 2005-12-15 | Nec Corp | 面実装用電子部品の取付け構造 |
-
1990
- 1990-02-14 JP JP1416490U patent/JPH073575Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH03104963U (en]) | 1991-10-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4288840A (en) | Printed circuit board | |
JPH03295266A (ja) | 高集積半導体装置 | |
JPH02260450A (ja) | 半導体装置およびその実装方法 | |
JPH073575Y2 (ja) | 中継端子 | |
JPS5954247A (ja) | 電子部品 | |
JPH09318965A (ja) | 液晶表示装置 | |
JPH02159791A (ja) | 電子部品の面実装方法 | |
JPH02213148A (ja) | テープキャリア | |
JPS61225827A (ja) | 半導体素子の実装構造 | |
JPH0722577A (ja) | 混成集積回路装置 | |
JPH02216891A (ja) | 回路基板の接続方法 | |
JPH0250464A (ja) | 格子配列形半導体素子パッケージ | |
JPH0432762Y2 (en]) | ||
JPS6273640A (ja) | ハイブリツド型集積回路 | |
JPH0661639A (ja) | ワイヤボンディングチップ構造 | |
JPH0577870U (ja) | クロスチップ | |
JPS62120376U (en]) | ||
JPS5952659U (ja) | 混成集積回路 | |
JPH0297042A (ja) | 電子部品搭載用基板 | |
JPH0672249U (ja) | 集積回路装置 | |
JPH0550731U (ja) | 絶縁基板,それを用いた半導体装置および回路装置 | |
JPS61225825A (ja) | Ic実装構造 | |
JPH05326833A (ja) | 半導体実装基板 | |
JPH01273384A (ja) | 集積回路装置 | |
JPS5950593A (ja) | 電気部品の取付装置 |